GELEST® HIGH ELONGATION, THERMALLY CONDUCTIVE GAP FILLER TC02 101g Kit

Product Code: PP2-TC02
SDS Sheets: EU | US
TDS Sheets: US
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Prices listed are EXW price (Morrisville, PA US) in USD. Prices vary depending on currency and Incoterms.

Product data and descriptions listed are typical values, not intended to be used as specification.

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  • HMIS

    1-1-0-X
  • Density (g/mL)

    2.47
  • Density Temperature (˚C)

    25.00
  • Thermal Conductivity (W/m˚C, ˚C)

    1.15 W/mK

Additional Properties

  • Hardness

    Low

    • Safety

  • Packaging Under

    Nitrogen