GELEST® THERMALLY CONDUCTIVE GAP FILLER TC01 101g Kit

Product Code: PP2-TC01
CAS No: Not found
SDS Sheets: EU | US
TDS Sheets: US
Pack Size
Quantity
Price
 
cspk
Contact Us For Pricing

Prices listed are EXW price (Morrisville, PA US) in USD. Prices vary depending on currency and Incoterms.

Product data and descriptions listed are typical values, not intended to be used as specification.

Interested in a Commercial Order?

  • HMIS

    1-1-0-X
  • TSCA

    No
  • Density (g/mL)

    2.09-2.19
  • Density Temperature (˚C)

    25.00
  • Dielectric Strength (V/m)

    20-40 kV/mm
  • Thermal Conductivity (W/m˚C, ˚C)

    0.74 - 0.86 W/mK

Additional Properties

  • Hardness

    Low
  • Safety

  • Packaging Under

    Nitrogen