GELEST® THERMALLY CONDUCTIVE GAP FILLER TC01 101g Kit

Product Code: PP2-TC01
CAS No: Not found
SDS Sheets: EU | US
TDS Sheets: US
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Prices listed are EXW price (Morrisville, PA US) in USD. Prices vary depending on currency and Incoterms.

Product data and descriptions listed are typical values, not intended to be used as specification.

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  • HMIS

    1-1-0-X
  • TSCA

    No
  • Density (g/mL)

    2.09-2.19
  • Density Temperature (˚C)

    25.00
  • Dielectric Strength (V/m)

    20-40 kV/mm
  • Thermal Conductivity (W/m˚C, ˚C)

    0.74 - 0.86 W/mK

Additional Properties

  • Hardness

    Low

    • Safety

  • Packaging Under

    Nitrogen